4.1 out of 5 stars with 50 reviews
Innovative Sensor Technology-MFS 02 confected by bonding process on PCB MFS02.PEXP.0, 34.4 x 10.8 x 1 mm(Pack of 3)
List Price
$208.33
Our Price
$206.25
Savings
1% OFF
* Pricing Information Updated Less Then A Minute Ago
Substrate: glass Tolerance: Temperatur Sensor (Pad 1-8): 800 Ohm +/-10% R1 (Pad 2-3): 720 Ohm +/- 10% R2 (Pad 3-4): 720 Ohm R3 (Pad 5-6): 530 Ohm +/- 10% R4 (Pad 6-7): 530 Ohm Matching between elements (R1 & R2 and acc. R3 & R4): 2% TCR: 3670ppm/K +/- 80ppm/K Resistivity at T=0°C Chip-Dimension: 3.5 x 5.1 x 0.5 mm (LxWxH) PCB-dimension: 34.4 x 10.8 x 1 mm (LxWxH) PCB 4 mm shorter milled and discharged Sensor Contacts: bonding pads Note: Temperatur Sensor not at the level of the membrane (redesign) Special: Sensors contacted by bonding process of PCB PCB- Layout: V1.0 |
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Thermal Massflow Sensor Component on PCB for gas with ultra low thermal mass resulting in high sensitivity and fast response time
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Excellent for low mass flow
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Robust construction
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Excellent long term stability,Bare sensor element resists short-term up to +275 °C
Product Information Specifications for Innovative Sensor Technology-MFS 02 confected by bonding process on PCB MFS02.PEXP.0, 34.4 x 10.8 x 1 mm(Pack of 3) Below:
| Manufacturer | Innovative Sensor Technology |
| Brand | Innovative Sensor Technology |
| Model | 050.00206 |
| Units in Package | 3 |
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